From MEMS devices to smart integrated systems

被引:0
|
作者
O. Soeraasen
J. E. Ramstad
机构
[1] University of Oslo,Department of Informatics
来源
Microsystem Technologies | 2008年 / 14卷
关键词
Cantilever Beam; Metal Layer; CMOS Process; Negative Resistance; Motional Resistance;
D O I
暂无
中图分类号
学科分类号
摘要
The smart integrated systems of tomorrow would demand a combination of micromechanical components and traditional electronics. On-chip solutions will be the ultimate goal. One way of making such systems is to implement the mechanical parts in an ordinary CMOS process. This procedure has been used to design an oscillator consisting of a resonating cantilever beam and a CMOS Pierce feedback amplifier. The resonating frequency is changed if the beam is bent by external forces. The paper describes central features of this procedure and highlights the design considerations for the CMOS-MEMS oscillator. The circuit is used as an example of a “VLSI designer” way of making future integrated micromechanical and microelectronic systems on-chip. The possibility for expansion to larger systems is reviewed.
引用
收藏
页码:895 / 901
页数:6
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