Effects of residual stress on fracture strength of Si3N4/stainless steel joints with a Cu-interlayer

被引:0
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作者
Hwisouck Chang
Sung-Churl Choi
Sang-Whan Park
Tae-Woo Kim
机构
[1] Hanyang University,Department of Inorganic Material Engineering
[2] Korea Institute of Science and Technology,Multifunctional Ceramics Research Center
[3] Kook-Min University,School of Mechanical Engineering
关键词
brazing; interlayer; joining; silicon-nitride;
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学科分类号
摘要
The variation in fracture strength of a brazed Si3N4/Cu/steel joint was compared with the change in residual stress as a function of the Cu-interlayer thickness that was used. The higher residual stress and the lower measured fracture strength for the joint, using a 0.1 mm thick Cu-interlayer, were ascribed to the entire dissolution of the Cu-interlayer into the brazing alloy. The finite element analysis of residual stress, which considered the microstructure at the interface region, could explain the fracture behavior for the brazed joints, which is dependent on the thickness of the Cu-interlayer.
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页码:640 / 644
页数:4
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