Evolution of Bimodal Microstructure and High-Temperature Wear Resistance of Al-Cu-Ni Alloys

被引：0
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作者：
Shubhadeep Maity
Dipak Kr. Chanda
Parthiban Ramasamy
Bijay Kumar Show
Jürgen Eckert
Supriya Bera
机构：
[1] National Institute of Technology,Department of Metallurgical and Materials Engineering
[2] Jadavpur University,School of Materials Science and Nano Technology
[3] Austrian Academy of Sciences,Erich Schmid Institute of Materials Science
[4] Montanuniversität Leoben,Department of Materials Science
来源：
Metallurgical and Materials Transactions A | 2020年 / 51卷
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摘要：
We report excellent high-temperature (300 °C) wear resistance of copper mold-cast Al80Cu15Ni5 and Al75Cu15Ni10 alloys. The evolution of a novel bimodal microstructure consisting of α-Al, eutectic α-Al + Al2Cu, and a vacancy ordered phase (Al3Ni2 type) restricts severe adhesive and abrasive wear at high temperature. Particularly, the Al75Cu15Ni10 alloy shows a low wear rate at 300 °C. In-depth microstructural characterization of the as-cast alloys and the worn samples elucidate the wear mechanism.
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页码：109 / 115
页数：6
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