Tensile Properties and Fracture Behavior of ATI 718Plus Alloy at Room and Elevated Temperatures

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作者
Micheal Kattoura
Gopal B. Viswanathan
Seetha R. Mannava
Dong Qian
Vijay K. Vasudevan
机构
[1] University of Cincinnati,Department of Mechanical and Materials Engineering
[2] The Ohio State University,Department of Materials Science and Engineering
[3] University of Texas at Dallas,Department of Mechanical Engineering
来源
Metallurgical and Materials Transactions A | 2021年 / 52卷
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摘要
The effect of temperature over the range of ambient to 704 °C and strain rate from 10−4 to 10−2 s−1 on the tensile properties and fracture behavior of ATI 718Plus was investigated. The results showed that with increase in temperature at a strain rate 10−4 s−1, there is a small reduction in the yield strength, but a large drop in ductility at 704 °C. This reduction was accompanied by a change in fracture mode from ductile transgranular to brittle intergranular cracking. Detailed analysis of the microstructure and microchemistry of the areas around the crack using electron microscopy showed that the driving mechanism behind the failure at elevated temperatures and slow strain rates is oxygen-induced intergranular cracking, a dynamic embrittlement mechanism. In addition, the results suggest that the δ precipitates on the grain boundaries tend to oxidize and may facilitate the oxygen-induced intergranular cracking. Finally, an increase in strain rate at 704 °C caused a small increase in the yield strength and a huge increase in ductility. This increase in ductility was accompanied by a change in fracture mode from brittle-to-ductile failure. Possible mechanisms for the deformation, failure mechanisms, and strain rate dependence are discussed.
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页码:3553 / 3569
页数:16
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