High-Temperature Creep Degradation of the AM1/NiAlPt/EBPVD YSZ System

The failure mechanisms of a NiAlPt/electron beam physical vapor deposition yttria-stabilized-zirconia thermal barrier coating system deposited on the AM1 single crystalline substrate have been investigated under pure creep conditions in the temperature range from 1273 K to 1373 K (1000 °C to 1100 °C) and for durations up to 1000 hours. Doubly tapered specimens were used allowing for the analysis of different stress states and different accumulated viscoplastic strains for a given creep condition. Under such experiments, two kinds of damage mechanisms were observed. Under low applied stress conditions (i.e., long creep tests), microcracking is localized in the vicinity of the thermally grown oxide (TGO). Under high applied stress conditions, an unconventional failure mechanism at the substrate/bond coat interface is observed because of large creep strains and fast creep deformation, hence leading to a limited TGO growth. This unconventional failure mechanism is observed although the interfacial bond coat/top coat TGO thickening is accelerated by the mechanical applied stress beyond a given stress threshold.