EFFECTS OF THE LASER–WATER-JET PROCESSING OF SILICON CARBIDE

被引:0
|
作者
Y. Chen
X. Li
X. Chen
H. Li
X. Xu
机构
[1] School of Mechanical Engineering,
[2] Hefei University of Technology,undefined
[3] School of Mechanical and Electrical Engineering,undefined
[4] Anhui Jianzhu University,undefined
关键词
laser–water-jet processing; silicon carbide; water-jet angle; water-jet velocity;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:11 / 16
页数:5
相关论文
共 50 条
  • [1] EFFECTS OF THE LASER-WATER-JET PROCESSING OF SILICON CARBIDE
    Chen, Y.
    Li, X.
    Chen, X.
    Li, H.
    Xu, X.
    JOURNAL OF APPLIED MECHANICS AND TECHNICAL PHYSICS, 2022, 63 (01) : 11 - 16
  • [2] Influence of Water Jet Assisted Laser Processing Silicon Carbide
    Chen Xuehui
    Xiang, Li
    Chao, Wu
    Yao, Zhang
    LASER & OPTOELECTRONICS PROGRESS, 2019, 56 (01)
  • [3] Experimental research on water-jet guided laser processing
    Li, Ling
    Wang, Yang
    Yang, Lijun
    Chu, Jiecheng
    FUNDAMENTAL PROBLEMS OF OPTOELECTRONICS AND MICROELECTRONICS III, PTS 1 AND 2, 2007, 6595
  • [4] Laser and Water-jet Fiber Coupling Technology for Water-jet Guided Laser Micromachining
    Wang, Y.
    Yang, L. J.
    Tang, J.
    Li, L.
    Chen, Y. B.
    ULTRA-PRECISION MACHINING TECHNOLOGIES, 2009, 69-70 : 29 - +
  • [5] Laser and water-jet fiber coupling technology for water-jet guided laser micromachining
    School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China
    Guangxue Jingmi Gongcheng, 2008, 9 (1614-1621):
  • [6] Analysis on the Coupling Error of Laser and Water-jet in Water-jet Guided Laser Micromachining
    Yang, L. J.
    Li, C. Q.
    Tang, J.
    Wang, Y.
    Chen, Y. B.
    HIGH SPEED MACHINING, 2011, 188 : 190 - +
  • [7] Experiment and simulation study of laser dicing silicon with water-jet
    Bao, Jiading
    Long, Yuhong
    Tong, Youqun
    Yang, Xiaoqing
    Zhang, Bin
    Zhou, Zupeng
    APPLIED SURFACE SCIENCE, 2016, 387 : 491 - 496
  • [8] Laser water-jet based dicing
    Fraunhofer Inst for Manufacturing, Engineering and Automation, , Germany
    European Semiconductor, 2000, 22 (04):
  • [9] Simulation and Experimental Research on Water-jet guided Laser Cutting Silicon Wafer
    Wang Yang
    Li Ling
    Yang Lijun
    Liu Bei
    Wang Zhe
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 826 - 831
  • [10] Effects of different processing parameters on laser water jet-machining silicon
    Chen, Y.
    Li, X.
    Chen, X.
    Li, H.
    THERMOPHYSICS AND AEROMECHANICS, 2022, 29 (06) : 929 - 939