A Review of Recent Trends and Challenges in Computational Modeling of Paper and Paperboard at Different Scales

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作者
Jaan-Willem Simon
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[1] RWTH Aachen University,Institute of Applied Mechanics
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摘要
Paper and paperboard are widely used in packaging products. The material behavior of paper and paperboard is very complex because different scales need to be considered in order to describe all relevant effects and phenomena. In particular, at least three scales can be distinguished: the fiber scale, network scale, and sheet scale. Since it is extremely challenging to measure the material behavior experimentally on all of these scales simultaneously, computational modeling of these materials has gained importance in recent years. This work aims at giving a systematic review of the numerical approaches and obtained results published in recent years. Focus is set on both the recent trends and achievements as well as challenges and open questions.
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页码:2409 / 2428
页数:19
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