Thermal stability of highly nanotwinned copper: The role of grain boundaries and texture

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作者
Yifu Zhao
Timothy Allen Furnish
Michael Ernest Kassner
Andrea Maria Hodge
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[1] University of Southern California,Department of Aerospace and Mechanical Engineering
[2] Los Angeles,undefined
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To study the effect of nanotwins on thermal stability, a comprehensive characterization study was performed on two types of ultrafine grained (UFG) copper samples, with and without nanotwins. The two samples were sequentially heat-treated at elevated temperatures, and the grain size, grain boundary character, and texture were characterized after each heat treatment. The as-prepared nanotwinned (nt) copper foil had an average columnar grain size of ≈700 nm with a high density of coherent twin boundaries (CTBs) (twin thickness, ≈40 nm), which remained stable up to 300 °C. In contrast, the other UFG sample had few CTBs, and rapid grain growth was observed at 200 °C. The thermal stability of nt copper is discussed with respect to the presence of the low energy nanotwins, triple junctions between the twins and columnar grains, texture and grain growth.
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页码:3049 / 3057
页数:8
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