Ni-Re (Nickel-Rhenium)

被引:0
|
作者
H. Okamoto
机构
[1] Asahi University,Business Administration
关键词
Experimental Data; Mass Transfer; Phase Diagram; Thermodynamic Parameter; Diffusion Couple;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:346 / 346
相关论文
共 50 条
  • [1] Ni-Re (Nickel-Rhenium)
    Okamoto, H.
    JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION, 2012, 33 (04) : 346 - 346
  • [2] DIFFUSION IN THE NICKEL-RHENIUM SYSTEM
    NEUBAUER, CM
    MARI, D
    DUNAND, DC
    SCRIPTA METALLURGICA ET MATERIALIA, 1994, 31 (01): : 99 - 104
  • [3] ELECTRODEPOSITION OF NICKEL-RHENIUM ALLOY.
    Efimov, E.A.
    Gerish, T.V.
    Protection of Metals (English translation of Zaschita Metallov), 1982, 18 (06): : 782 - 784
  • [4] PHYSICAL-PROPERTIES OF NICKEL-RHENIUM ALLOYS
    HOFMANN, U
    PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1976, 33 (01): : 119 - 123
  • [5] Corrosion Behavior of Nickel-Rhenium Alloys in Concentrated Acids
    Parshutin, V. V.
    Gerasimov, M. V.
    Bogdashkina, N. L.
    JOURNAL OF SURFACE INVESTIGATION, 2021, 15 (05): : 975 - 979
  • [6] Nickel-rhenium compound sheds light on the potency of rhenium as a strengthener in high-temperature nickel alloys
    Maisel, Sascha B.
    Schindzielorz, Nils
    Mottura, Alessandro
    Reed, Roger C.
    Mueller, Stefan
    PHYSICAL REVIEW B, 2014, 90 (09):
  • [7] Nickel-Rhenium Electrolytic Alloys: Synthesis, Structure, and Corrosion Properties
    Bersirova, O. L.
    Kublanovsky, V. S.
    MATERIALS SCIENCE, 2019, 54 (04) : 506 - 511
  • [8] INVESTIGATION OF ELECTRODEPOSITED NICKEL-RHENIUM THIN FILMS .1.
    PISHIKIN, AM
    POPEREKA, MY
    KHAZANKI.VB
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII FIZIKA, 1969, (02): : 7 - &
  • [9] INVESTIGATION OF ELECTRODEPOSITED NICKEL-RHENIUM THIN FILMS .2.
    PISHIKIN, AM
    POPEREKA, MY
    KHAZANKIN, VB
    IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENII FIZIKA, 1969, (02): : 11 - +
  • [10] Theoretical exploration on mechanical properties for Ni-RE intermetallic compounds in nickel alloy
    Wu, Xianggang
    Huang, Yuhao
    Zha, Dong
    Liu, Yong
    Chen, Jie
    Luo, Lan
    Zhang, Xumin
    Luo, Dingfu
    MATERIALS TODAY COMMUNICATIONS, 2022, 33