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- [3] The influence of curing agent content on the mechanical and adhesive properties of dicyandiamide cured epoxy systems JOURNAL OF ADHESION, 1995, 55 (1-2): : 31 - 42
- [5] Microscale mechanical properties dependent on the strain rate and temperature of cured isotropic conductive adhesive Mechanics of Time-Dependent Materials, 2021, 25 : 249 - 264
- [6] Properties of composites based on radiation cured binders and metal powders Plasticheskie Massy: Sintez Svojstva Pererabotka Primenenie, 1995, (03): : 26 - 27
- [7] Adhesive properties of cured phenylethynyl-containing imides Chang, A.C., 1600, Gordon & Breach Science Publ Inc, Reading, United Kingdom (72):
- [8] Adhesive properties of cured phenylethynyl-containing imides JOURNAL OF ADHESION, 2000, 72 (02): : 209 - 217