Microstructure Prediction during Hot Deformation using New Dynamic Recrystallization Model and Finite Element Analysis

被引:0
|
作者
Lee, Ho Won [1 ]
Lee, Young-Seon [1 ]
Kang, Seong-Hoon [1 ]
机构
[1] Korea Inst Mat Sci, Mat Deformat Dept, Chang Won 642831, Gyeongnam, South Korea
来源
MATERIAL FORMING ESAFORM 2014 | 2014年 / 611-612卷
关键词
Dynamic Recrystallization Model; Finite Element Analysis; Microstructure; CELLULAR-AUTOMATA; SIMULATION; NUCLEATION;
D O I
10.4028/www.scientific.net/KEM.611-612.483
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, dynamic recrystallization during nonisothermal hot deformation was numerically simulated by finite element analysis and new physically based dynamic recrystallization model. The dynamic recrystallization model was developed based on mean field approach by assuming grain aggregate as representative volume element. For each grain aggregate, changes of state variables such as dislocation density and grain size were calculated using three sub- models for work hardening, nucleation, and nucleus growth. The developed dynamic recrystallization model was validated by comparing with isothermal hot compression of pure copper. Finally, developed dynamic recrystallization model was combined with finite element method to predict the local changes of microstructure and average grain size during nonisothermal hot compression of pure copper and hot tube extrusion of austenitic stainless steel. The simulation results were in reasonably good agreement with experimentally determined microstructures.
引用
收藏
页码:483 / 488
页数:6
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