Numerical solution of the problem of the limiting current for the copper electrodeposition from a solution of cupric sulfate and sulfuric acid in conditions of natural convection

被引:6
|
作者
Volgin, VM [1 ]
Grigin, AP
Davydov, AD
机构
[1] Tula State Univ, Tula, Russia
[2] Russian Acad Sci, Framkin Inst Electrochem, Moscow 119071, Russia
关键词
Copper; Sulfate; Physical Chemistry; Convection; Boundary Layer;
D O I
10.1023/A:1023392020203
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Equations for a boundary layer, written in self-similar variables, are integrated numerically to obtain distributions of concentration of ions Cu2+, H+, and SO42-; a hydrodynamic velocity; partial currents of electrolyte components; and the limiting current of copper deposition and determine the Rayleigh number for the system under consideration. The results are compared with an approximate analytical solution obtained earlier.
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页码:335 / 349
页数:15
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