Microstructure Evolution and Chemical Composition in Continuous Directional Solidification Cu-P-Sn Alloy

Ternary Cu-P-Sn alloy was prepared by continuous directional solidification (CDS) technique. The microstructure of CDS Cu-P-Sn alloy was analyzed by optical microscopy and field emission scanning electron microscopy. The chemical composition was analyzed by energy dispersive spectrometry. The results show that the CDS Cu-P-Sn alloy has many linear structures. The linear structures are vertically arranged along the solidification direction in the longitudinal section and arranged with a disorderly manner in the transverse section. The number of linear structures also is larger in transverse section than in longitudinal section. CDS Cu-P-Sn alloy has an exudation layer with a lamellar structure, which has high solute contents of P and Sn.