Positive pattern formation and its mechanism from ionic bonded negative photosensitive polyimide

被引：1

作者：

Yoshida, Satoshi ^{[1
]}

Eguchi, Masuichi ^{[1
]}

Tamura, Kazutaka ^{[1
]}

Tomikawa, Masao ^{[1
]}

机构：

[1] Toray Ind Ltd, Elect & Imaging Mat Res Labs, Otsu, Shiga 5200842, Japan

来源：

JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2007年 / 20卷 / 02期

关键词：

poly(amic acids); photosensitive amine; imidization control;

D O I：

10.2494/photopolymer.20.145

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

We found positive pattern formation by ionic bonded photo-sensitive polyimide (PSPI). The PSPI is composed of poly(amic acid), photo-reactive tertiary amine (such as N.N-dimethylaminoethylacrylate), and photo-initiator The PSPI basically has negative photo-sensitivity. However, we found that positive pattern formation from the PSPI when adding a post-exposure bake (PEB) about 120-140C. By adding PEB, imidization rate of unexpostire area of PSPI is higher than did of exposed area. High imidizaiton of unexposed area of PSPI makes hard to solubuile to alkaline solution. The imidization rate difference attributes to glass transition temperature difference between exposed area and unexposed area.

引用

页码：145 / 147

页数：3

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