A study of localised galvanic replacement of copper and silver films with gold using scanning electrochemical microscopy

被引：21
|
作者：
O'Mullane, Anthony P. [1 ]
Ippolito, Samuel J. [1 ]
Bond, Alan M. [2 ]
Bhargava, Suresh K. [1 ]
机构：
[1] RMIT Univ, Sch Appl Sci, Melbourne, Vic 3001, Australia
[2] Monash Univ, Sch Chem, Clayton, Vic 3800, Australia
来源：
ELECTROCHEMISTRY COMMUNICATIONS | 2010年 / 12卷 / 05期
关键词：
Galvanic replacement; SECM; Microfabrication; LATERAL CHARGE PROPAGATION; NANOSTRUCTURES; AG; NANOPARTICLE; PATTERNS; SURFACES; HOLLOW;
D O I：
10.1016/j.elecom.2010.02.012
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
Galvanic replacement represents a highly significant process for the fabrication of bimetallic materials, but to date its application has been limited to either modification of large area metal surfaces or nanoparticles in solution. Here, the localised surface modification of copper and silver substrates with gold through the galvanic replacement process is reported. This was achieved by generation of a localised flux of AuCl(4)(-) ions from a gold ultramicroelectrode tip which interacts with the unbiased substrate of interest. The extent of modification with gold can be controlled through the tip substrate distance and electrolysis time. (c) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码：611 / 615
页数：5
相关论文
共 50 条
  • [1] Localised electrochemical desorption of gold alkanethiolate monolayers by means of scanning electrochemical microscopy (SECM)
    Wilhelm, T
    Wittstock, G
    MIKROCHIMICA ACTA, 2000, 133 (1-4) : 1 - 9
  • [2] Localised Electrochemical Desorption of Gold Alkanethiolate Monolayers by Means of Scanning Electrochemical Microscopy (SECM)
    Thomas Wilhelm
    Gunther Wittstock
    Microchimica Acta, 2000, 133 (1) : 1 - 9
  • [3] Annealing study of gold films using scanning tunneling microscopy
    Racah Institute of Physics, Hebrew University, Jerusalem 91904, Israel
    J. Vac. Sci. Technol. A Vac. Surf. Films, 3 (1165-1170):
  • [4] Characterisation of localised corrosion processes using scanning electrochemical impedance microscopy
    Kuznetsov, Volodymyr
    Maljusch, Artjom
    Souto, Ricardo M.
    Bandarenka, Aliaksandr S.
    Schuhmann, Wolfgang
    ELECTROCHEMISTRY COMMUNICATIONS, 2014, 44 : 38 - 41
  • [5] Corrosion Electrochemical Kinetic Study of Copper in Acidic Solution using Scanning Electrochemical Microscopy
    Zhang, Qinhao
    Zhu, Zejie
    Liu, Pan
    Zhang, Jianqing
    Cao, Fahe
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2019, 166 (13) : C401 - C409
  • [6] Patterning Gold Nanoparticle Using Scanning Electrochemical Microscopy
    Abad, Jose M.
    Tesio, Alvaro Y.
    Pariente, Felix
    Lorenzo, Encarnacion
    JOURNAL OF PHYSICAL CHEMISTRY C, 2013, 117 (42): : 22087 - 22093
  • [7] DEPOSITION OF COPPER, SILVER, AND NICKEL ON ALUMINUM BY GALVANIC REPLACEMENT
    Kuntyi, O. I.
    Zozulya, H. I.
    Dobrovets'ka, O. Ya.
    Kornii, S. A.
    Reshetnyak, O. V.
    MATERIALS SCIENCE, 2018, 53 (04) : 488 - 494
  • [8] Deposition of Copper, Silver, and Nickel on Aluminum by Galvanic Replacement
    О. І. Kuntyi
    H. І. Zozulya
    О. Ya. Dobrovets’ka
    S. А. Kornii
    О. V. Reshetnyak
    Materials Science, 2018, 53 : 488 - 494
  • [9] Electron transport in gold nanoparticle films investigated by scanning electrochemical microscopy
    Stoycheva, Violeta
    Lee, Dongil
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2007, 233
  • [10] ANNEALING STUDY OF GOLD-FILMS USING SCANNING-TUNNELING-MICROSCOPY
    PORATH, D
    BARSADEH, E
    WOLOVELSKY, M
    GRAYEVSKY, A
    GOLDSTEIN, Y
    MILLO, O
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1995, 13 (03): : 1165 - 1170
12345