Measurement of dynamic tensile strength of nanocrystalline copper by laser irradiation

被引：7
|
作者：
Wang, Yonggang
He, Hongliang
Boustie, Michel
Sekine, Toshimori
机构：
[1] Inst Fluid Phys, Lab Shock Wave & Detonat Phys Res, Mianyang 621900, Peoples R China
[2] ENSMA, LCD, F-86961 Futuroscope, France
[3] Natl Inst Mat Sci, Adv Mat Lab, Tsukuba, Ibaraki 3050044, Japan
来源：
JOURNAL OF APPLIED PHYSICS | 2007年 / 101卷 / 10期
基金：
中国国家自然科学基金;
关键词：
D O I：
10.1063/1.2734952
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
An approach is developed to investigate the dynamic tensile fracture of nanocrystalline copper by laser irradiation loading. A push-pull type velocity interferometer system for any reflector is used to measure the rear free surface velocity profiles. The dynamic tensile strength of nanocrystalline copper films is determined from these velocity profiles as a function of the tensile strain rate. Results show that the dynamic tensile strength of nanocrystalline copper film is about 3 GPa, which is much higher than that of polycrystalline bulk copper, but lower than that of single crystal copper. This dynamic tensile strength increase may be attributed to constraints on dislocation motion by more grain boundaries in nanocrystalline materials. (c) 2007 American Institute of Physics.
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页数：4
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