Study on reduction in radiated emissions from PCB using test LSI

被引：0
|
作者：
Haga, S [1 ]
Nakano, K
Sudo, T
Hashimoto, O
机构：
[1] Assoc Super Adv Elect Technol ASET, Tsukuba Ctr Inc, 1-6,Sengen 2 Chome, Tsukuba, Ibaraki 3050047, Japan
[2] Aoyama Gakuin Univ, Dept Elect Engn & Elect, Tokyo 150, Japan
来源：
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | 2003年 / 36卷 / 04期
关键词：
radiated emission; test LSI; output buffer operation; near magnetic field distribution; near electric field distribution;
D O I：
10.1002/mop.10732
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Radiation mechanism and reduction measures have been studied rising test large scale integrated (LSI) circuits. The LSI operation mode that simultaneously v drives external traces radiates the greatest amount of emissions. In this mode, air LSI-inounted area has been found to behave as an opening from the electromagnetic viewpoint. Two approaches under consideration, ferrite on the LSI package and a copper sheet covering the LSI package, were verified to reduce emissions very effectively. (C) 2003 Wiley Periodicals, Inc.
引用
收藏
页码：238 / 242
页数：5
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