Bonding characteristics during very high power ultrasonic additive manufacturing of copper

被引：104
|
作者：
Sriraman, M. R. [1 ]
Babu, S. S. [1 ]
Short, M. [2 ]
机构：
[1] Ohio State Univ, Welding Engn Program, Columbus, OH 43221 USA
[2] Edison Welding Inst, Columbus, OH 43221 USA
来源：
SCRIPTA MATERIALIA | 2010年 / 62卷 / 08期
关键词：
Ultrasonic additive manufacturing; Welding; Electron backscattering diffraction; Copper; Dynamic recrystallization; DYNAMIC RECRYSTALLIZATION; CONSOLIDATION; ALUMINUM; ENERGY;
D O I：
10.1016/j.scriptamat.2009.12.040
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Welding of copper foils (150 mu m thick) achieved at room temperature by very high power ultrasonic additive manufacturing was seen to involve appreciable softening and enhanced plastic flow. The initial coarse-grained structure (25 mu m) in the material changed into fine dynamically recrystallized grains (0.3-10 mu m) at the foil interface within the order of a few milliseconds of processing. This phenomenon led to metallurgical bonding through grain boundary migration and allowed for successive welding of tapes to form a three-dimensional part. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：560 / 563
页数：4
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