MEMS modular packaging and interfaces

被引：9
|
作者：
Schuenemann, M [1 ]
Jam, KA [1 ]
Grosser, V [1 ]
Leutenbauer, R [1 ]
Bauer, G [1 ]
Schaefer, W [1 ]
Reichl, H [1 ]
机构：
[1] Fraunhofer Inst Mfg Engn & Automat IPA, D-70569 Stuttgart, Germany
来源：
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS | 2000年
关键词：
D O I：
10.1109/ECTC.2000.853232
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Many industrial branches other than automotive industry may benefit from MEMS technology. Most of them require custom-designed MEMS in mid-scale volumes, which are at present not available at acceptable costs. A modular MEMS packaging and interface concept may contribute to less costly solutions with faster time to market. A 3D stackable packaging concept, the Top-Bottom Ball Grid Array TB-BGA, which includes electric, fluidic, optic, and communication interfaces, is proposed. Several realization technologies (LTCC, 3D-BGA, StackPack) as well as first applications are discussed.
引用
收藏
页码：681 / 688
页数：6
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