Full-bit functional, high-density 8 Mbit one transistor-one capacitor ferroelectric random access memory embedded within a low-power 130 nm logic process

被引:10
|
作者
Udayakumar, K. R.
Moise, T. S.
Summerfelt, S. R.
Boku, K.
Remack, K. A.
Gertas, J.
Haider, A.
Obeng, Y.
Martin, J. S.
Rodriguez, J.
Shinn, G.
McKerrow, A.
Eliason, J.
Bailey, R.
Fox, G. R.
机构
[1] Texas Instruments Inc, Dallas, TX 75243 USA
[2] Ramtron Int Corp, Colorado Springs, CO 80921 USA
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2007年 / 46卷 / 4B期
关键词
FRAM; memory; nonvolatile; bit distribution; PZT; ferroelectric; embedded; low-power;
D O I
10.1143/JJAP.46.2180
中图分类号
O59 [应用物理学];
学科分类号
摘要
We report the electrical properties of a full-bit functional 8 Mbit one transitor-one capacitor (IT-1C) embedded ferroelectric random access memory (eFRAM) fabricated within a low-leakage 130 nm 51, in Cu interconnect complementary metal oxide semiconductor (CMOS) logic process. To increase manufacturability and reliability margins, we have introduced a single-bit substitution methodology that replaces bits at the low-end of the original distribution with redundant elements leading to an increased signal margin. Further, we have fabricated a digital signal processor (DSP) using the eFRAM process flow and have shown that the operating frequency is nearly the same relative to the CMOS baseline. With the development of logic-compatible eFRAM, we have created a technology platform that enables ultra-low-power devices.
引用
收藏
页码:2180 / 2183
页数:4
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