Adherent polyaniline films on aluminum alloy 2024-T3 have been prepared by electrodeposition from aniline containing oxalic acid solution. The most appropriate method to prepare protective films was a successive galvanostatic deposition of 500 seconds. With this type of film, the open circuit potential of the coating shifted around 0.150 V vs. SCE compared to the uncoated alloy. The polyaniline coatings can be considered as a candidate to protect copper-rich aluminum alloy by avoiding the galvanic couple between re-deposited copper on the surface and the bulk alloy.