Research of bipolar amplification effect in single event transient

被引:21
|
作者
Liu Zheng [1 ]
Chen Shu-Ming [1 ]
Liang Bin [1 ]
Liu Bi-Wei [1 ]
Zhao Zhen-Yu [1 ]
机构
[1] Natl Univ Def Technol, Inst Microelect & Microprocessor, Coll Comp, Changsha 410073, Hunan, Peoples R China
关键词
single event transient; bipolar amplification; mixed-mode TCAD simulation; plateau region of current; 130; NM; IRRADIATION; UPSET;
D O I
10.7498/aps.59.649
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Using 3-D mixed-mode simulation, bipolar amplification effect in an inverter chain of single event transient (SET) is studied, and compared with that in single NMOS. It is found that bipolar amplification component takes a large proportion in SET current pulse, but not in an inverter chain. The difference of source/substrate biases between them and the mechanism of amplification are explained, which validates the conclusion that bipolar amplification depends on the bias of source/substrate. The positive current component from source to drain and the mechanism of SET pulse are also studied, and results show that the source current change is positive in the plateau region because of the presence of carrier diffusion.
引用
收藏
页码:649 / 654
页数:6
相关论文
共 13 条
  • [1] Mitigation techniques for single event induced charge sharing in a 90 nm bulk CMOS process
    Amusan, O. A.
    Massengill, L. W.
    Baze, M. P.
    Bhuva, B. L.
    Witulski, A. F.
    Black, J. D.
    Balasubramanian, A.
    Casey, M. C.
    Black, D. A.
    Ahlbin, J. R.
    Reed, R. A.
    McCurdy, M. W.
    [J]. 2008 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 46TH ANNUAL, 2008, : 468 - +
  • [2] Charge collection and charge sharing in a 130 nm CMOS technology
    Amusan, Oluwole A.
    Witulski, Arthur F.
    Massengill, Lloyd W.
    Bhuva, Bharat L.
    Fleming, Patrick R.
    Alles, Michael L.
    Sternberg, Andrew L.
    Black, Jeffrey D.
    Schrimpf, Ronald D.
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2006, 53 (06) : 3253 - 3258
  • [3] Digital single event transient trends with technology node scaling
    Benedetto, J. M.
    Eaton, P. H.
    Mavis, D. G.
    Gadlage, M.
    Turflinger, T.
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2006, 53 (06) : 3462 - 3465
  • [4] DASGUPTA S, 2007, THESIS VANDERBILT U, P12
  • [5] Basic mechanisms and modeling of single-event upset in digital microelectronics
    Dodd, PE
    Massengill, LW
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2003, 50 (03) : 583 - 602
  • [6] Charge enhancement effect in NMOS bulk transistors induced by heavy ion irradiation - Comparison with SOI
    Ferlet-Cavrois, V
    Vizkelethy, G
    Paillet, P
    Torres, A
    Schwank, JR
    Shaneyfelt, MR
    Baggio, J
    de Pontcharra, JD
    Tosti, L
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2004, 51 (06) : 3255 - 3262
  • [7] Test methods of total dose effects in very large scale integrated circuits
    He, CH
    Geng, B
    He, BP
    Yao, YJ
    Li, YH
    Peng, HL
    Lin, DS
    Zhou, H
    Chen, YS
    [J]. ACTA PHYSICA SINICA, 2004, 53 (01) : 194 - 199
  • [8] Experimental study on irradiation effects in floating gate ROMs
    He, CH
    Geng, B
    Yang, HL
    Chen, XH
    Wang, YP
    Li, GZ
    [J]. ACTA PHYSICA SINICA, 2003, 52 (01) : 180 - 187
  • [9] Monte Carlo simulation of the SRAM single event upset
    Hua, Li
    [J]. ACTA PHYSICA SINICA, 2006, 55 (07) : 3540 - 3545
  • [10] Simultaneous single event charge sharing and parasitic bipolar conduction in a highly-scaled SRAM design
    Olson, BD
    Ball, DR
    Warren, KM
    Massengill, LW
    Haddad, NF
    Doyle, SE
    McMorrow, D
    [J]. IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2005, 52 (06) : 2132 - 2136