Modified PDMS packaging of sensory e-textile circuit microsystems for improved robustness with washing

Electronic Textiles (e-textiles) should ideally be handled and cleaned like traditional textiles. Therefore, we can expect e-textiles to be machine washed or hand washed. As e-textiles enhance traditional fabrics with electronic functionality, any embedded microsystem i.e., flexible electronic circuits, will be expected to survive and show functionality after the e-textile has been washed multiple times to ensure the garment is practical. Therefore, the choice of encapsulation material for microsystems in a textile must be hydrophobic and offer minimal expansion when washed and ensure the electronics are undetectable when the textile is handled or cleaned. This paper evaluates five different base/curing agent mixing ratios-5:1, 7:1, 10:1, 15:1, and 20:1-of commercial polydimethylsiloxane (PDMS) as an electronic packaging encapsulation. Contact angle and aqueous permeability experiments were conducted to tailor the PDMS mixture specifically for washable e-textile applications. The experimental results show that 20:1 PDMS is the most suitable as it is sufficiently hydrophobic with minimal swelling in commercial washing machine trials. Following this, a 40.3 mu m-thick 20:1 conformal encapsulation of PDMS upon an touch and proximity flexible circuit that can be integrated into textiles via knitting and/or weaving, was examined. Results show the washing spin speed is a crucial factor with washing cycle duration having minimal impact when determining circuit functionality survival. Overall, the e-textiles in this work survived between 10 and 15 washes with microscopic inspection of the circuits revealing failure of the external wires but not the PDMS encapsulation-suggesting its sufficient robustness and durability as a suitable encapsulation material for washable electronic textiles.