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- [2] Layer stackup analysis of multi-layer PCB ICEMI'2003: PROCEEDINGS OF THE SIXTH INTERNATIONAL CONFERENCE ON ELECTRONIC MEASUREMENT & INSTRUMENTS, VOLS 1-3, 2003, : 1318 - 1322
- [3] Via design in multi-layer PCB ASIA-PACIFIC CONFERENCE ON ENVIRONMENTAL ELECTROMAGNETICS, CEEM'2003, PROCEEDINGS, 2003, : 94 - 98
- [6] The EMI benefits of ground plane stitching in multi-layer power bus stacks 2000 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD, 2000, : 833 - 838
- [7] Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB 2003 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SYMPOSIUM RECORD, VOLS 1 AND 2, 2003, : 231 - 235
- [8] The effects of signal layer positions in multi-layer PCB designs 2002 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD, 2002, : 320 - 324
- [9] A Printed Array Antenna for Multi-layer PCB Design 2017 INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (ISAP 2017), 2017,