0.065 mu m gate InGaP/InGaAs/GaAs pseudomorphic HEMTs with highly-doped 11.5 nm thick InGaP electron supply layers

被引:6
|
作者
Nihei, M
Hara, N
Suehiro, H
Kuroda, S
机构
[1] Fujitsu Laboratories Ltd., Atsugi 243-01
关键词
D O I
10.1016/S0038-1101(97)00118-4
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrated that the thinning of InGaP electron supply layers is very effective in reducing short channel effects, even for 0.065 mu m gate InGaP/InGaAs/GaAs pseudomorphic HEMTs. By thinning the InGaP electron supply layer to 11.5 nm with a high doped density of 5 x 10(18) cm(-3), we were able to minimize the threshold voltage shift to less than 0.15 V compared to 1.65 mu m gate length HEMTs. We could also increase the extrinsic transconductance (g(m)) by thinning the InGaP electron supply layer. We observed no degradation of gate leakage characteristics, regardless of such a highly-doped, thin InGaP layer. The 0.065 mu m gate length HEMT exhibits an extrinsic transconductance (g(m)) of 585 mS mm(-1), a current gain cutoff frequency (f(T)) of 110 GHz and a maximum oscillation frequency (f(max)) of 150 GHz. (C) 1997 Elsevier Science Ltd.
引用
收藏
页码:1647 / 1650
页数:4
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