LC Low-pass filter based on through-silicon via

被引：0
|
作者：
Wang, Fengjuan [1 ]
Huang, Jia [1 ]
Yu, Ningmei [1 ]
机构：
[1] Xian Univ Technol, Sch Automat & Informat Engn, Xian, Shaanxi, Peoples R China
来源：
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC) | 2019年
基金：
中国博士后科学基金; 中国国家自然科学基金;
关键词：
low-pass filter; through-silicon via (TSV); three-dimensional integrated circuits (3-D IC); VIAS;
D O I：
10.1109/edssc.2019.8754270
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Low-pass filters (LPFs) are widely used in mobile terminals and many military radar receiver systems in order to alter the frequency spectrum of signals passing through it. So based on the technology of through-silicon via, we propose in this paper a third-order low-pass filter (LPF) which consists of planar spiral inductors and TSV array capacitor. The simulation result of proposed LPF shows that the cutoff frequency is about 20GHz and the ultra-compact size is only 10850 mu m(2). In addition, the components of TSV LPF are further investigated so as to figure the LPF characteristics clearly out.
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页数：3
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