Bond Wire Antenna/Feed for Operation Near 60 GHz

被引：34

作者：

Wu, Hsin-Ta ^{[1
]}

Tekle, Mengasha ^{[1
]}

Nallani, C. Shashank ^{[1
]}

Zhang, Ning ^{[1
]}

Kenneth, K. O. ^{[2
]}

机构：

[1] Univ Florida, Gainesville, FL 32611 USA

[2] Univ Texas Dallas, Richardson, TX 75080 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2009年 / 57卷 / 12期

基金：

美国国家科学基金会;

关键词：

antenna; bond wire; interconnect; wireless; CHIP;

D O I：

10.1109/TMTT.2009.2033836

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A bond wire antenna/feed for use near 60 GHz is demonstrated. A gold bond wire with similar to 1-mil diameter is co-optimized with a bond pad to resonate at similar to 60 GHz. With a metal cover representing an enclosure for an electronic system (2 mm from a printed circuit board), the antenna pair gain at 10-cm separation is similar to -53 dB including the effects of two nearby bond wires located 300 m away. This is sufficient for building an interchip 1-Gbps radio link with bit error rate of 10(-12). Without the metal cover, the range is reduced to similar to 4-5 cm. The bond wire antennas with efficiency of similar to 30% should also be useful for general purpose over the air communication in the 60-GHz unlicensed band.

引用

页码：2966 / 2972

页数：7

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