Dynamic analysis of bifurcating, non-linear thin film micro-structures

被引:0
|
作者
Carey, MW
Chase, JG
Carr, AJ
Kowarz, MW
机构
[1] Univ Canterbury, Dept Mech Engn, Christchurch, New Zealand
[2] Univ Canterbury, Dept Civil Engn, Christchurch, New Zealand
[3] Eastman Kodak Co, Integrated Mat & Microstruct Lab, Rochester, NY 14650 USA
关键词
dynamic; finite element; residual stress; large deflection; geometric stiffness; hybrid stress; Newmark constant average acceleration; bifurcation; electrostatic;
D O I
10.1016/j.engstruct.2004.06.019
中图分类号
TU [建筑科学];
学科分类号
0813 ;
摘要
As micro-device application in consumer and commercial products develops, efficient tools are required to simulate device dynamics and assess structural performance. An integrated methodology is developed for studying the dynamics of thin film bifurcating structures. Results are presented for a generic thin film structure, which exhibit classical electro-mechanical hysteresis. Such structures can be used to produce light modulating micro-electro-mechanical system (MEMS) devices. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1821 / 1831
页数:11
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