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- [1] Easy bootstrap for the 3D Ising model: a hybrid approach of the lightcone bootstrap and error minimization methods JOURNAL OF HIGH ENERGY PHYSICS, 2024, (07):
- [4] Signal Integrity Analysis for High Speed Channels in PCB/Package Co-Design Interface: 3D Full Wave vs. 2D/Hybrid Approach & Full Model vs. Segmentation Approach PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 585 - 588