The 56xx Desktop Micro Factory - the New Equipment for Wire-Bond Technologies

被引：0

作者：

Sedlmair, J. ^{[1
]}

Berger, S. ^{[1
]}

机构：

[1] F&K Delvotec Semicond GmbH, A-5280 Braunau Inn, Austria

来源：

ACTA PHYSICA POLONICA A | 2009年 / 116卷

关键词：

D O I：

暂无

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

F&K Delvotec Austria, located in Braunau, is a member of the F&K Delvotec group and focuses on bonding and testing equipment for small-scale production of high-quality electronic and semiconductor parts. The second business area concerns itself with developing and adapting bonding processes for new or unusual applications in the industry, such as bonding non-standard wire materials on non-standard surfaces, such as copper ribbon to reinforce the current-carrying capability of pc-boards.

引用

页码：S196 / S197

页数：2

共 2 条

[1] Desktop factory - New approaches for lean micro assembly
Klemd, Olaf
2007 IEEE International Symposium on Assembly and Manufacturing, 2007, : 161 - 165
[2] Modeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies
Boriskov, P. P.
Ershova, N. Yu
Putrolaynen, V. V.
Seredov, P. N.
Belyaev, M. A.
INTERNATIONAL SCIENTIFIC CONFERENCE ON APPLIED PHYSICS, INFORMATION TECHNOLOGIES AND ENGINEERING (APITECH-2019), 2019, 1399

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