Assembly & packaging challenges

被引：0
|
作者：
Chang, CS [1 ]
Bracken, RC
Oscilowski, A
机构：
[1] SEMATECH, Austin, TX 78741 USA
[2] Semicond Res Corp, Res Triangle Pk, NC USA
来源：
SOLID STATE TECHNOLOGY | 1998年 / 41卷 / 03期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：90 / +
页数：2
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