Heat transfer and pressure drop in fractal microchannel heat sink for cooling of electronic chips

被引：0
|
作者：
Liu, S. T. [1 ]
Zhang, Y. C. [1 ]
机构：
[1] Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China
来源：
CURRENT DEVELOPMENT IN ABRASIVE TECHNOLOGY, PROCEEDINGS | 2006年
关键词：
microchannel; heat sink; fractal;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, the improved design of fractal branching channel net that can meet the demand for cooling of rectangular electronic chip with arbitrary ratio of length to width is presented. A theory model is proposed that estimate performance of heat transfer and pressure drop approximately. It is found that the optimal total branching level is 7 and the ratio of length to width is 1.87 at the fixed cooling surface for fractal microchannel heat sink.
引用
收藏
页码：331 / +
页数：2
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