TCAD Investigation of Differently Doped DLC Passivation for Large-Area High-Power Diodes

被引:2
|
作者
Reggiani, Susanna [1 ,2 ]
Balestra, Luigi [1 ,2 ]
Gnudi, Antonio [1 ,2 ]
Gnani, Elena [1 ,2 ]
Baccarani, Giorgio [1 ,2 ]
Dobrzynska, Jagoda [3 ]
Vobecky, Jan [3 ,4 ]
Tosi, Carlo [3 ,5 ]
机构
[1] Univ Bologna, ARCES Res Ctr, IT-40136 Bologna, Italy
[2] Univ Bologna, DEI Dept, IT-40136 Bologna, Italy
[3] ABB Switzerland Ltd, Semicond, CH-5600 Lenzburg, Switzerland
[4] Czech Tech Univ, Fac Elect Engn, Microelect Dept, Prague 16636, Czech Republic
[5] Evatec AG, CH-9477 Trubbach, Switzerland
关键词
Doping; Passivation; Silicon; Conductivity; Boron; Nitrogen; Leakage currents; Bevel termination; diamond-like carbon (DLC) simulation; large-area diode; TCAD modeling;
D O I
10.1109/JESTPE.2019.2921871
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An electroactive passivation for high-voltage diodes with bevel termination has been investigated based on diamondlike carbon (DLC) films. Variations of the DLC properties, i.e., conductivity and geometry, have been investigated by experiments and numerical simulations to the purpose of gaining an insight on their influence on the diode leakage current and breakdown voltage. The role played by the DLC/Si interface has been investigated by characterizing metal-DLC-Si devices. Both boron and nitrogen doping have been investigated, and a TCAD setup has been provided accounting for the main transport features of the DLC material with different doping configurations. A significant polarization effect has been observed in the DLC material, which improves the DLC performance as a passivation material. High-voltage diodes have been characterized and simulated with different DLC layers on top of the bevel termination in order to identify the role played by conductivity and polarization on the blocking state. The correlation of leakage current and voltage breakdown with the DLC doping and thickness is provided and explained by the TCAD simulation results.
引用
收藏
页码:2155 / 2162
页数:8
相关论文
共 50 条
  • [1] TCAD study of DLC coatings for large-area high-power diodes
    Reggiani, S.
    Balestra, L.
    Gnudi, A.
    Gnani, E.
    Baccarani, G.
    Dobrzynska, J.
    Vobecky, J.
    Tosi, C.
    MICROELECTRONICS RELIABILITY, 2018, 88-90 : 1094 - 1097
  • [2] TCAD Study of VLD Termination in Large-Area Power Devices Featuring a DLC Passivation
    Balestra, L.
    Reggiani, S.
    Gnudi, A.
    Gnani, E.
    Dobrzynska, J.
    Vobecky, J.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 67 (11) : 4645 - 4648
  • [3] Numerical Investigation of the Leakage Current and Blocking Capabilities of High-Power Diodes with Doped DLC Passivation Layers
    Balestra, Luigi
    Reggiani, Susanna
    Gnudi, Antonio
    Gnani, Elena
    Baccarani, Giorgio
    Dobrzynska, Jagoda
    Vobeckji, Jan
    2019 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES (SISPAD 2019), 2019, : 243 - 246
  • [4] Large-area high-power VCSEL
    Miller, M
    Grabherr, M
    Jäger, R
    Unold, HJ
    Ebeling, KJ
    2000 IEEE 17TH INTERNATIONAL SEMICONDUCTOR LASER CONFERENCE, CONFERENCE DIGEST, 2000, : 63 - 64
  • [5] Large-area conditioning of optics for high-power laser systems
    Sheehan, Lynn M.
    Kozlowski, Mark R.
    Rainer, Frank
    Staggs, Michael C.
    Proceedings of SPIE - The International Society for Optical Engineering, 1994, 2114 : 559 - 568
  • [6] Investigation of low loss and high reliability encapsulation technology in large-area, high-power semiconductor devices
    Morita, T
    Kato, M
    Onuki, J
    Onose, H
    Matsuura, N
    Sakurada, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1999, 38 (11): : 6232 - 6236
  • [7] Investigation of low loss and high reliability encapsulation technology in large-area, high-power semiconductor devices
    Morita, Toshiaki
    Kato, Mitsuo
    Onuki, Jin
    Onose, Hidekatsu
    Matsuura, Nobuyoshi
    Sakurada, Shuroku
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1999, 38 (11): : 6232 - 6236
  • [8] Influence of the DLC Passivation Conductivity on the Performance of Silicon High-Power Diodes Over an Extended Temperature Range
    Balestra, L.
    Reggiani, S.
    Gnudi, A.
    Gnani, E.
    Dobrzynska, J.
    Vobecky, J.
    IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2021, 9 : 431 - 440
  • [9] Large-area high-power THz emitter based on interdigitated electrodes
    Dreyhaupt, A
    Winnerl, S
    Dekorsy, T
    Helm, M
    CONFERENCE DIGEST OF THE 2004 JOINT 29TH INTERNATIONAL CONFERENCE ON INFRARED AND MILLIMETER WAVES AND 12TH INTERNATIONAL CONFERENCE ON TERAHERTZ ELECTRONICS, 2004, : 83 - 84
  • [10] Vibration Response of a High-Power Compact Large-Area Ultrasonic Resonator
    Osman, Hafiiz
    Osman, Hafiiz
    Lim, Fannon
    Lucas, Margaret
    2017 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2017,