Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

被引：19

作者：

Lim, Adeline B. Y. ^{[1
,2
]}

Chang, Andrew C. K. ^{[1
]}

Yauw, Oranna ^{[1
]}

Chylak, Bob ^{[3
]}

Gan, Chee Lip ^{[2
]}

Chen, Zhong ^{[2
]}

机构：

[1] Kulicke & Soffa Pte Ltd, Singapore 554369, Singapore

[2] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

[3] Kulicke & Soffa Ind Inc, Ft Washington, PA 19034 USA

来源：

MICROELECTRONICS RELIABILITY | 2014年 / 54卷 / 11期

关键词：

Palladium-coated copper wire; Palladium distribution; Grain structure; Electronic Flame Off current;

D O I：

10.1016/j.microrel.2014.05.005

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) wire has become widely used as it is believed to improve reliability. In this paper, we experimented with 0.6 ml PdCu and bare Cu wires. Palladium distribution and grain structure of the PdCu Free Air Ball (FAB) were investigated. It was observed that Electronic Flame Off (EFO) current and the cover gas type have a significant effect on palladium distribution in the FAB. The FAB hardness was measured and correlated to palladium distribution and grain structure. First bond process responses were characterized. The impact of palladium on wire bondability and wire bond intermetallic using a high temperature storage test was studied. (C) 2014 Elsevier Ltd. All rights reserved.

引用

页码：2555 / 2563

页数：9

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