Chemical vapor deposition of silicon nitride thin films from tris(diethylamino)chlorosilane

被引:5
|
作者
Liu, XJ [1 ]
Pu, XP [1 ]
Li, HL [1 ]
Qiu, FG [1 ]
Huang, LP [1 ]
机构
[1] Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 200050, Peoples R China
基金
中国国家自然科学基金;
关键词
chemical vapor deposition; silicon nitride; thin films; tris(diethylamino)chlorosilane;
D O I
10.1016/j.matlet.2004.05.058
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In an attempt to synthesize amorphous silicon nitride (a-SiNx) thin films with minimal incoporation of impurities, a novel liquid precursor, tris(diethylamino)chlorosilane (TDEACS), was synthesized and proven to be an ideal candidate as a silicon and nitrogen source for depositing of high-quality a-SiNx thin films. a-SiNx films with low carbon and hydrogen contents were prepared from a TDEACS-NH3-N-2 system by the LPCVD technique. The films were characterized by X-ray photoelectron spectroscopy, Auger depth profile, Fourier transform infrared spectroscopy, elastic recoil detection, and atomic force microscopy, respectively. Carbide-containing a-SiNx films were obtained at lower NH3/TDEACS ratios while all deposits were essentially stoichiometric at higher NH3/TDEACS ratios. Both carbon and hydrogen contents of the as-prepared a-SiNx films were markedly lower than of those prepared from other organic precursors previously reported. The surface topography of the as-prepared film was smooth and uniform with a root-mean-square roughness of 0.53 nm. (C) 2004 Published by Elsevier B.V.
引用
收藏
页码:11 / 14
页数:4
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