Polymeric materials for electronics packaging

被引：0
|
作者：
Liu, J [1 ]
机构：
[1] Chalmers Univ Technol, SE-41296 Gothenburg, Sweden
来源：
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2000年 / 23卷 / 03期
关键词：
D O I：
10.1109/TCAPT.2000.868838
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
[No abstract available]
引用
收藏
页码：419 / 419
页数：1
相关论文
共 50 条
  • [1] NEW POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING
    HACKER, H
    HAUSCHILDT, KR
    HUBER, J
    LAUPENMUHLEN, H
    WILHELM, D
    ACS SYMPOSIUM SERIES, 1989, 407 : 414 - 420
  • [2] POLYMERIC MATERIALS FOR ELECTRONICS PACKAGING AND INTERCONNECTION - AN OVERVIEW
    LUPINSKI, JH
    MOORE, RS
    ACS SYMPOSIUM SERIES, 1989, 407 : 1 - 25
  • [3] Polymeric electronics packaging - Foreword
    Morris, JE
    Liu, J
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (02): : 206 - 207
  • [4] Packaging materials for power electronics
    Journal of Japan Institute of Electronics Packaging, 2010, 13 (01) : 2 - 4
  • [5] The Study on Bulging Mechanism of Plastic Packaging Materials for Electronics Materials for Electronics
    Gu, Jiabao
    Tang, Yanhuang
    Liang, Junhao
    Xu, Huanxiang
    Chen, Chengcheng
    Liu, Zilian
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [6] Thermal Materials for Packaging Power Electronics
    Misra, Sanjay
    Advancing Microelectronics, 2020, 47 (05): : 16 - 19
  • [7] Polymeric antistats find more use in electronics packaging
    Graff, G
    MODERN PLASTICS, 1996, 73 (08): : 28 - 29
  • [8] Electrospray Printing of Polymeric and Metallic Coatings for Electronics Packaging
    Pawliczak, Emma E.
    Kingsley, Bryce J.
    Chiarot, Paul R.
    2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 1455 - 1462
  • [9] Transparency of polymeric food packaging materials
    Guzman-Puyol, Susana
    Benitez, Jose J.
    Heredia-Guerrero, Jose A.
    FOOD RESEARCH INTERNATIONAL, 2022, 161
  • [10] NEW POLYMERIC MATERIALS FOR ELECTRONIC PACKAGING
    HACKER, H
    HAUSCHILDT, KR
    HUBER, J
    LAUPENMUHLEN, H
    WILHELM, D
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1988, 196 : 186 - PMSE
12345