Microstructure and Properties of High Strength and High Conductivity Cu-Nb Microcomposite

被引：0
|
作者：
Liang Ming [1 ,2 ]
Chen Zili [1 ]
Lu Yafeng [1 ]
Li Chenshan [1 ]
Yan Guo [1 ]
Li Jinshan [2 ]
Zhang Pingxiang [1 ,2 ]
机构：
[1] NW Inst Nonferrous Met Res, Xian 710016, Peoples R China
[2] NW Polytech Univ, State Key Lab Solidificat Proc, Xian 710072, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2009年 / 38卷 / 10期
关键词：
bundling and drawing process; Cu-Nb; tensile strength; electrical resistivity; FIELD PULSED MAGNETS; NANOFILAMENTARY CONDUCTORS; PERSPECTIVES; STABILITY; WIRES;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Cu-Nb microcomposite wire materials containing N=85(4) niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 mu Omega.cm at 77 K. The conductivity values could be greater than 70%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm(2). And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.
引用
收藏
页码：1774 / 1777
页数：4
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