Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

被引：0
|
作者：
Sato, Yuga [1 ]
Kariya, Yoshiharu [2 ]
机构：
[1] Shibaura Inst Technol, Grad Sch, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan
[2] Shibaura Inst Technol, Koto Ku, 3-7-5 Toyosu, Tokyo 1358548, Japan
来源：
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年
关键词：
D O I：
10.23919/ltb-3d.2019.8735106
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A method of analyzing cure shrinkage behaviors of UV curable adhesive with the use of a general purpose FEM code was proposed, and effects of influential factors on misalignment of camera lens fixing were analyzed. It was found that the interactions between the cure shrinkage of the adhesive and the differences in coating volume was highly significant.
引用
收藏
页码：47 / 47
页数：1
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