共 50 条
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- [2] Guided modes in a Si-quantum wire and their control JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (2B): : 861 - 864
- [6] Finite Element analysis of wire clamp for wire bonding 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 954 - 957
- [8] Finite element analysis for grinding of wire-sawn silicon wafers: a designed experiment INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2003, 43 (01): : 7 - 16
- [10] Guided modes in an arbitrarily oriented Si-quantum wire and their control PHYSICA B, 1996, 227 (1-4): : 330 - 332