Dynamic data split: A crosstalk suppression scheme in TSV-based 3D IC

被引：1
|
作者：
Wang, Qin [1 ]
Chen, Zhenyang [2 ]
Jiang, Jianfei [1 ]
Guo, Zheng [1 ]
Mao, Zhigang [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Dept Microelect & Nanosci, 800 Dong Chuan Rd, Shanghai 200240, Peoples R China
[2] Intel Asia Pacific Res & Dev Ctr, 880 Zi Xing Rd, Shanghai 200241, Peoples R China
来源：
INTEGRATION-THE VLSI JOURNAL | 2017年 / 59卷
基金：
中国国家自然科学基金;
关键词：
TSV; Crosstalk suppression; Mapping; 3D IC; THROUGH-SILICON VIAS;
D O I：
10.1016/j.vlsi.2017.04.003
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Through-silicon via (TSV) technology improves transmission bandwidth in three-dimensional integrated circuits (3D ICs) due to its short connection path. However, it is limited by crosstalk issues, especially in closely spaced TSV clusters. The present study proposed a cost-effective scheme called the "dynamic data split" for optimization. The presented scheme was compared with other schemes, and its memory access requests from the L1 cache to L2 cache were examined using benchmarks such as SPEC2006Int. The proposed scheme presented the best bandwidth improvement at a minimal cost, i.e., it achieved a 15.75% improvement on requests for instruction fetches, in contrast to the 7.01% improvement observed in other dynamic mapping schemes.
引用
收藏
页码：23 / 30
页数：8
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