Implementation of Short-Pulse Lasers for Wafer Scribing and Grooving Applications

被引：5

作者：

Gobet, Mathilde ^{[1
]}

Obi, Samuel ^{[1
]}

Pavius, Michael ^{[1
]}

Takano, Masaki ^{[1
]}

Vago, Nandor ^{[1
]}

Lee, Kyumin ^{[1
]}

Kozuki, Yasushi ^{[1
]}

Pauchard, Alexandre ^{[1
]}

机构：

[1] Synova SA, CH-1024 Ecublens, Switzerland

来源：

JOURNAL OF LASER MICRO NANOENGINEERING | 2010年 / 5卷 / 01期

关键词：

Laser; micro-machining; short pulse; water-jet guided laser; grooving; scribing; edge isolation;

D O I：

10.2961/jlmn.2010.01.0004

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

This paper presents micro-machining results obtained by combining a short-pulse 10 ns green laser with the water jet-guided laser technology. The short pulse duration offers significant advantages for a wide range of applications. Experimental results of semiconductor grooving, edge isolation and P1 fabrication step of thin film solar cells, as well as silicon wafer dot marking, are presented. The study compares the results obtained with short and long pulse lasers.

引用

页码：16 / 20

页数：5

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