Microstructure, Mechanical Property and Interfacial Reaction of Sn-Cu Based Multicomponent Lead-Free Solders

被引：0
|
作者：
Zhao Ning [1 ]
Ma Haitao [1 ]
Wang Lai [1 ]
机构：
[1] Dalian Univ Technol, Sch Mat Sci & Engn, State Key Lab Mat Modificat, Dalian 116024, Peoples R China
来源：
RARE METAL MATERIALS AND ENGINEERING | 2009年 / 38卷
关键词：
multicomponent lead-free solder; Sn-Cu; DSC; tensile property; interfacial reaction; INTERMETALLIC COMPOUNDS; SURFACE FINISH; PACKAGES; REFLOW; PB;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The melting behavior, microstructure, tensile property and interfacial reactions with Ni substrates of two multicomponent solders, namely Sn-2Cu-0.5Ni (SC-Ni) and Sn-2Cu-0.5Ni-0.5Au (SC-NiAu) were studied. Results show that the addition of Au decreases the melting point of SC-NiAu alloy. The intermetallic compounds (IMC) of the two solders formed in the matrixes are both based on Cu6Sn5 structure. After soldered with Ni substrate at 260 degrees C for 60 s, stick-like (Cu,Ni)(6)Sn-5 IMC are found at SC-Ni/Ni and SC-NiAu/Isli interfaces. The tensile strength and elongation percentage are obtained by tensile tests, and comparisons are made with eutectic Sn-0.7Cu alloy.
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页码：107 / 111
页数：5
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