共 13 条
- [3] Reliability Assessment of Algangan Hemts for High Voltage Applications Based on High Temperature Reverse Bias Test PROCEEDINGS OF 2014 10TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS), VOLS I AND II, 2014, : 298 - 301
- [4] Bias temperature reliability of p-channel high-voltage devices MICROELECTRONICS AND RELIABILITY, 1997, 37 (10-11): : 1767 - 1770
- [5] Polymeric Packaging of High Power Semiconductor Devices: Material Selection & Reliability Assessment PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 118 - 123
- [6] Reliability Assessment of Cu-Al WB Under High Temperature and Voltage Bias PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021), 2021, : 861 - 867
- [7] Development of A New Package for Next Generation Power Semiconductor Devices: toward High Temperature and High Voltage Applications 2013 IEEE 10TH INTERNATIONAL CONFERENCE ON POWER ELECTRONICS AND DRIVE SYSTEMS (IEEE PEDS 2013), 2013, : 512 - 516
- [8] Novel Solution for High-Temperature Dielectric Application to Encapsulate High-Voltage Power Semiconductor Devices IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (01): : 3 - 9
- [10] Reliability Test of a Power System Containing High Voltage Circuit Breaker Under Different Operating Conditions 2018 IEEE 7TH INTERNATIONAL CONFERENCE ON POWER AND ENERGY (PECON), 2018, : 241 - 245