共 50 条
- [1] Transient Electrical-Thermal Co-Simulation in the Design of On-Chip and 3-D Interconnects 2015 31st International Review of Progress in Applied Computational Electromagnetics (ACES) Vol 31, 2015,
- [2] Transient Electrical-Thermal Analysis of 3-D Power Distribution Network With FETI-Enabled Parallel Computing IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (10): : 1684 - 1695
- [3] Three-Dimensional Iterative Electrical-Thermal Co-simulation (3-D IETC) Method for Power/Thermal Integrity Analysis 2016 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2016, : 167 - 168
- [4] Electrical-thermal characterization of carbon nanotube based through glass vias for 3-D integration 2016 IEEE 16TH INTERNATIONAL CONFERENCE ON NANOTECHNOLOGY (IEEE-NANO), 2016, : 663 - 666
- [5] Electrical-Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (04): : 588 - 601
- [6] The thermal analysis of brake disc with 3-D coupled analysis ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, 2005, 297-300 : 305 - 310
- [8] Transient Electrical Thermal Analysis of ESD Process using 3-D Finite Element Method PROCEEDINGS OF THE 2009 12TH INTERNATIONAL SYMPOSIUM ON INTEGRATED CIRCUITS (ISIC 2009), 2009, : 153 - 156
- [9] Electrical-Thermal Co-Simulation for Through Silicon Via and Active Tier in 3-D IC 2018 JOINT IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY AND 2018 IEEE ASIA-PACIFIC SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC/APEMC), 2018, : 110 - 110
- [10] Development of coupled 3-D neutronics/thermal-hydraulics code for SCWR core transient analysis Hedongli Gongcheng/Nuclear Power Engineering, 2014, 35 : 186 - 189