Correlation among mechanical and electrical properties of conductive adhesive joints

被引:0
|
作者
Duraj, Ales [1 ]
Mach, Pavel [1 ]
Samal, David [1 ]
Friese, Marcus [2 ]
Busek, David [1 ]
机构
[1] Czech Tech Univ, Dept Elect Technol, Fac Elect Engn, Prague, Czech Republic
[2] HTV, Dresden, Germany
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The paper is focused on investigation of correlation among changes of the resistance and nonlinearity of adhesive joints fabricated of 6 types of isotropic electrically conductive adhesives with epoxy resin binder and silver filler. Long-time static mechanical load, climatic load caused by ageing of adhesive joints at the temperature of 125 degrees C, climatic load at the relative humidity of 100 %, and combined load temperature-humidity (80 degrees C, 80 % RH) have been used for study of changes of loaded adhesive joints. Correlation among changes caused by different types of load, applied on one type of adhesive joints, has been examined. Correlation among changes caused by the same type of load, applied on different types of adhesive joints, has also been investigated.. Good correlation has been found rarely. Therefore it is possible to conclude that correlation among changes caused by different types of climatic and mechanical load have not been found.
引用
收藏
页码:413 / +
页数:2
相关论文
共 50 条
  • [1] Improving electrical and mechanical properties of a conductive nano adhesive
    Ekrem, Mursel
    Ataberk, Necati
    Avci, Ahmet
    Akdemir, Ahmet
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2017, 31 (07) : 699 - 712
  • [2] Influence of high current load on electrical properties of adhesive conductive joints
    Duraj, Ales
    Mach, Pavel
    Radev, Radoslav
    Matejec, Jan
    ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 1323 - +
  • [3] Electrical conduction models for isotropically conductive adhesive joints
    Li, L
    Morris, JE
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (01): : 3 - 8
  • [4] Electrical resistance modeling of isotropically conductive adhesive joints
    Mündlein, M
    Nicolics, J
    2005 28TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2005, : 128 - 133
  • [5] The Effect of Nano Fillers in Electrical and Mechanical Properties of Isotropic Conductive Adhesive
    Chew, C. S.
    Durairaj, R.
    Hwang, J.
    Tan, J.
    Liang, M. S.
    Tan, C. N.
    Chen, K. P.
    2014 IEEE 36TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT), 2015,
  • [6] Thermal and Mechanical stability of electrically conductive adhesive joints
    Jun Xiao
    D. D. L. Chung
    Journal of Electronic Materials, 2005, 34 : 625 - 629
  • [7] Thermal and mechanical stability of electrically conductive adhesive joints
    Xiao, J
    Chung, DDL
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (05) : 625 - 629
  • [8] Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering
    Li, Yi
    Moon, Kyoung-Sik
    Wong, C.P.
    Journal of Applied Polymer Science, 1600, 99 (04): : 1665 - 1673
  • [9] Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering
    Li, Y
    Moon, KS
    Wong, CP
    JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 99 (04) : 1665 - 1673
  • [10] Effect of heating on the electrical resistivity of conductive adhesive and soldered joints
    Kyu Dong Kim
    D. D. L. Chung
    Journal of Electronic Materials, 2002, 31 : 933 - 939