In Situ Probing the Kinetics of Gold Nanoparticle Thermal Sintering in Liquids: Implications for Ink-Jet Printing

被引:4
|
作者
Zhang, Xiuli [1 ]
Liu, Weiyan [1 ]
Li, Hailong [1 ]
Xia, Shuixin [1 ]
Tsung, Chia-Kuang [2 ]
Liu, Hao [3 ]
Liu, Wei [1 ]
Yu, Yi [1 ]
机构
[1] ShanghaiTech Univ, Sch Phys Sci & Technol, Shanghai 201210, Peoples R China
[2] Boston Coll, Dept Chem, Chestnut Hill, MA 02467 USA
[3] Donghua Univ, Ctr Adv Low Dimens Mat, Shanghai 201620, Peoples R China
基金
上海市自然科学基金; 中国国家自然科学基金;
关键词
in situ; liquid cell transmission electron microscopy; thermal sintering; gold nanoparticles; surface diffusion; TRANSMISSION ELECTRON-MICROSCOPY; DYNAMICS; GROWTH; SURFACE; AG; VISUALIZATION; TEMPERATURE; COALESCENCE; EVOLUTION; SCALE;
D O I
10.1021/acsanm.0c03133
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Understanding the sintering kinetics of nanoparticles is important for their applications, such as printable nanoinks and wearable devices. However, it is challenging to in situ study the sintering process at nanoscale in a liquid environment. In this work, in situ investigation of the thermal sintering of gold nanoparticles is performed using liquid cell transmission electron microscopy. We have observed the unique sintering process of two nanoparticles in the liquid phase. By heating the gold nanoparticle solution in a liquid cell, a neck formed between the two nanoparticles at the initial sintering stage, followed by a rapid increase of neck size accompanied by a more rounded surface, and finally, the as-formed gold dimer shrank to a short nanorod. The sintering observations are dominated by two different surface diffusion paths and grain boundary diffusion. Furthermore, the high surface energy of small nanoparticles results in a higher shrinkage ratio in sintering. This insight of the kinetics of nanoparticle sintering provided by in situ characterization offers guidance for the future applications such as ink-jet printing.
引用
收藏
页码:2538 / 2546
页数:9
相关论文
共 50 条
  • [1] Ink-jet printing and sintering of PZT
    Wang, TM
    Derby, B
    JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2005, 88 (08) : 2053 - 2058
  • [2] Low Sintering Temperature and Electrical Performance of Nanoparticle Copper Ink for Use in Ink-Jet Printing
    Cho, M. S.
    Choi, W. H.
    Kim, S. G.
    Kim, I. H.
    Lee, Y.
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2010, 10 (10) : 6888 - 6891
  • [3] Ink-jet printing of gold conductive tracks
    Nur, HM
    Song, JH
    Evans, JRG
    Edirisinghe, MJ
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2002, 13 (04) : 213 - 219
  • [4] Ink-jet printing of gold conductive tracks
    H. M. Nur
    J. H. Song
    J. R. G. Evans
    M. J. Edirisinghe
    Journal of Materials Science: Materials in Electronics, 2002, 13 : 213 - 219
  • [5] Ink-jet printing and microwave sintering of conductive silver tracks
    Perelaer, Jolke
    de Gans, Berend-Jan
    Schubert, Ulrich S.
    ADVANCED MATERIALS, 2006, 18 (16) : 2101 - +
  • [6] Gold nanoparticle ink suitable for electric-conductive pattern fabrication using in ink-jet printing technology
    Cui, Wenjuan
    Lu, Wensheng
    Zhang, Yakun
    Lin, Guanhua
    Wei, Tianxin
    Jiang, Long
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2010, 358 (1-3) : 35 - 41
  • [7] Chemiresistive sensor fabricated by the sequential ink-jet printing deposition of a gold nanoparticle and polymer layer
    Skotadis, E.
    Tang, Jun
    Tsouti, V.
    Tsoukalas, D.
    MICROELECTRONIC ENGINEERING, 2010, 87 (11) : 2258 - 2263
  • [8] A novel method to produce Pd nanoparticle ink for ink-jet printing technology
    Tseng, Chun-Chieh
    Chang, Chang-Pin
    Sung, Yuh
    Chen, Yann-Cheng
    Ger, Ming-Der
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2009, 339 (1-3) : 206 - 210
  • [9] TESTING UNPACKAGED THERMAL INK-JET PRINTING DEVICES
    HERMANSON, HA
    LORENZE, RV
    JOURNAL OF IMAGING SCIENCE AND TECHNOLOGY, 1994, 38 (01): : 68 - 73
  • [10] In Situ Fabrication of Polymeric Microcapsules by Ink-Jet Printing of Emulsions
    Deng, Renhua
    Wang, Yilin
    Yang, Lisong
    Bain, Colin D.
    ACS APPLIED MATERIALS & INTERFACES, 2019, 11 (43) : 40652 - 40661