共 50 条
- [1] New Methodologies for Evaluating Microelectronics Subject to Board-level Vibrations IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1366 - 1375
- [2] The investigation of board-level vibration for the stacked memory device 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 728 - 733
- [3] A New Methodology for Board-Level Harmonic Analysis of Multi-Level Packages 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1840 - 1845
- [4] The Affect of Device Level Modeling on System-Level Thermal Predictions 2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 245 - 249
- [6] Comparison of mechanical response of PCBs subjected to product-level and board-level drop impact tests PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 223 - 227
- [7] Elastoplastic harmonic analysis of board-level swept sine vibration tests EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 435 - 440
- [8] Study on the board-level drop test of the stacked memory device by FEA 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 724 - 727
- [9] Transient submodeling analysis for board-level drop tests of electronic packages IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (01): : 54 - 62
- [10] New Solutions for System-Level and High-Level Synthesis 2014 14TH INTERNATIONAL SYMPOSIUM ON INTEGRATED CIRCUITS (ISIC), 2014, : 71 - 74