First Tests of a New Facility for Device-Level, Board-Level and System-Level Neutron Irradiation of Microelectronics

被引:25
|
作者
Cazzaniga, Carlo [1 ]
Bagatin, Marta [2 ]
Gerardin, Simone [2 ]
Costantino, Alessandra [3 ]
Frost, Christopher D. [1 ]
机构
[1] Rutherford Appleton Lab, ISIS Facil, STFC, Didcot OX11 0QX, Oxon, England
[2] Padova Univ, DEI, Via Gradenigo 6B, I-35131 Padua, PD, Italy
[3] ESA ESTEC, Noordwijk, Netherlands
关键词
Neutron radiation effects; nuclear measurements; particle beams;
D O I
10.1109/TETC.2018.2879027
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The very limited availability of fast neutron facilities, particularly in Europe, for testing of microelectronics has motivated the construction of ChipIr, a new beamline at the ISIS neutron and muon source in the UK. ChipIr has been designed for Single Event Effect testing at the device-level, board-level and system-level which requires a beam of uniform intensity over a selectable area in the order of hundreds of cm(2). Measurements of the beam uniformity are presented in this paper. A memory chip of interest for space applications, based on SRAMs and developed by ESA for monitoring of radiation fields, has been used for a comparative characterization of the beam. Consistent results have been found, giving confidence on the intensity and shape of the fast neutron spectrum of ChipIr.
引用
收藏
页码:104 / 108
页数:5
相关论文
共 50 条
  • [1] New Methodologies for Evaluating Microelectronics Subject to Board-level Vibrations
    Khaldarov, Valeriy
    Xie, Dongji
    Lee, Jeffrey
    Shalumov, Alexander
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1366 - 1375
  • [2] The investigation of board-level vibration for the stacked memory device
    Li, Xiao
    Wang, Jun
    Zhao, Liyou
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 728 - 733
  • [3] A New Methodology for Board-Level Harmonic Analysis of Multi-Level Packages
    Chen, Cheng-fu
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1840 - 1845
  • [4] The Affect of Device Level Modeling on System-Level Thermal Predictions
    Weyant, Jens
    Reist, Daniel
    Garner, Scott
    2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 245 - 249
  • [5] System-Level Optimization of MEMS Thermal Wind Sensor Based on the Co-Simulation of Macromodel and Board-Level Interface Circuits
    Xu, Hao
    Wang, Jiuzhou
    Zhou, Zai-Fa
    Yi, Zhenxiang
    Qin, Ming
    Huang, Qing-An
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2023, 32 (06) : 574 - 582
  • [6] Comparison of mechanical response of PCBs subjected to product-level and board-level drop impact tests
    Ong, YC
    Shim, VPW
    Chai, TC
    Lim, CT
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 223 - 227
  • [7] Elastoplastic harmonic analysis of board-level swept sine vibration tests
    Yeh, Chang-Lin
    Lai, Yi-Shao
    EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 435 - 440
  • [8] Study on the board-level drop test of the stacked memory device by FEA
    Pang, Junwen
    Wang, Jun
    Zhao, Liyou
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 724 - 727
  • [9] Transient submodeling analysis for board-level drop tests of electronic packages
    Tsai, Tsung-Yueh
    Yeh, Chang-Lin
    Lai, Yi-Shao
    Chen, Rong-Sheng
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (01): : 54 - 62
  • [10] New Solutions for System-Level and High-Level Synthesis
    Zuo, Wei
    Zheng, Hongbin
    Gurumani, Swathi T.
    Rupnow, Kyle
    Chen, Deming
    2014 14TH INTERNATIONAL SYMPOSIUM ON INTEGRATED CIRCUITS (ISIC), 2014, : 71 - 74