A two-dimensional computer simulation of electroless copper deposition

被引：7

作者：

Shigematsu, K ^{[1
]}

Kondo, K ^{[1
]}

Hayakawa, K ^{[1
]}

Irie, M ^{[1
]}

机构：

[1] KYUSHU UNIV,FAC ENGN,DEPT CHEM SCI & TECHNOL,HIGASHI KU,FUKUOKA 812,JAPAN

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1997年 / 144卷 / 04期

关键词：

D O I：

10.1149/1.1837594

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

A two-dimensional computer simulation for electroless copper deposition was carried out using a Monte Carlo method. The equilibrium adsorption constants of ligands and Cu(II) ligand complexes on a sulssh ate were calculated for ethanolamine. The calculated equilibrium adsorption constants agreed well with the experimental results. Microvoid fractions in the plating structure were also estimated based on the equilibrium adsorption constants. The void fraction was useful in evaluating the fatigue ductility of copper plating.

引用

页码：1340 / 1343

页数：4

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