Thermal shock resistance of Ti3SiC2 ceramic under extremely rapid thermal cycling

被引:21
|
作者
Su, Xiaojia [1 ]
Bao, Yiwang [2 ]
Wan, Detian [2 ]
Zhang, Haibin [3 ]
Xu, Ludi [4 ]
Grasso, Salvatore [1 ]
Hu, Chunfeng [1 ]
机构
[1] Southwest Jiaotong Univ, Sch Mat Sci & Engn, Key Lab Adv Technol Mat, Minist Educ, Chengdu 610031, Peoples R China
[2] China Bldg Mat Acad, State Key Lab Green Bldg Mat, Beijing 100000, Peoples R China
[3] China Acad Engn Phys, Inst Nucl Phys & Chem, Mianyang 621900, Sichuan, Peoples R China
[4] Sichuan Aerosp Changzheng Equipment Mfg Co Ltd, Chengdu 610100, Peoples R China
关键词
Ti3SiC2; Microstructure; Quenching; Thermal shock resistance;
D O I
10.1016/j.jallcom.2021.158985
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
A rapid throughput thermal shock resistance evaluation method was developed and tested on Ti3SiC2 ceramic traditionally known for its excellent thermal shock resistance. The sample was rapidly heated by the induction heating and dropped into the cooling water within 0.35 s. The three-point bending test of Ti3SiC2 after quenching at 1300 degrees C dropped from initial 332 MPa down to 35 MPa. The testing bars fractured after quenching at 1450 degrees C without any abnormal strength recovery that was instead reported in previous investigations. The degradation of residual strength might be ascribed to three factors: (i) the oxide layer on the sample surface contains a lot of pores and microcracks; (ii) large thermal tensile stresses impact on the substrate during quenching; (iii) weak grain boundaries are caused by water infiltration. (C) 2021 Elsevier B.V. All rights reserved.
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页数:5
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