Open crack depth sizing by laser stimulated infrared lock-in thermography

被引:21
|
作者
Fedala, Y. [1 ,2 ]
Streza, M. [3 ]
Roger, J-P [2 ,4 ]
Tessier, G. [2 ,4 ,5 ]
Boue, C. [6 ,7 ,8 ]
机构
[1] Ecole Normale Super, Dept Biol, F-75005 Paris, France
[2] Inst Langevin, CNRS, UMR 7587, F-75005 Paris, France
[3] NIR&DIMT, Cluj Napoca 400293, Romania
[4] PSL Res Univ, Inst Langevin, ESPCI ParisTech, F-75005 Paris, France
[5] Univ Paris 05, Sorbonne Paris Cite, CNRS, Neurophoton Lab,Wavefront Engn Microscopy Grp,UMR, F-75006 Paris, France
[6] PSL Res Univ, ESPCI ParisTech, LPEM, F-75231 Paris 5, France
[7] Univ Paris 06, Univ Sorbonne, F-75005 Paris, France
[8] CNRS, UMR 8213, F-75005 Paris, France
关键词
crack depth estimation; infrared lock-in thermography; finite element methods; image processing; STEEL;
D O I
10.1088/0022-3727/47/46/465501
中图分类号
O59 [应用物理学];
学科分类号
摘要
Recent advances in infrared imaging have made active thermography an interesting non destructive technique for sub-surface defect detection. Here, we present a method for the estimation of the depth of open surface defects by infrared lock-in thermography, based on the relation between the crack depth and the Laplacian of the surface temperature distribution induced by a local heating using a laser. A comparison to numerical finite element modelling for different depths allows an accurate determination of fatigue crack depth in Inconel alloy test blocks.
引用
收藏
页数:6
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